Tresky presents metallic sintering for power electronics at productronica 2023
Tresky GmbH from Hennigsdorf near Berlin will present various metallic pre-sintering processes, including the Die Transfer Film (DTF) process, at this year’s productronica 2023 in Munich. Especially for bonding semiconductors such as IGBTs, SiC MOSFETs or GaN HEMTs with Ag on DBC or AMB substrates or for connecting power modules on heat sinks, metallic sintering offers a high-performance solution with maximum reliability.
Sintering as a key technology for the energy transition and e-mobility
Assemblies with high-performance semiconductors are key components for the global energy transition and electromobility. For this reason, Tresky GmbH from Hennigsdorf near Berlin has been working on this key technology for some time and will present further product and process innovations in 2023 as part of additional development steps.