For bonding semiconductors, such as IGBTs or SiC MOSFETs with Ag or Au on DBC or AMB substrates or for connecting power modules on heat sinks, metallic silver or copper sintering offers a high-performance solution with maximum reliability. If you are considering sintering as a bonding process, we offer you comprehensive solutions, from consulting, feasibility studies and process implementation to extensive after-sales support.
Tresky leads in tailored pre-sintering technologies. Our Sinter DIE Bonders, adaptable with a range of modules for paste application, kinematics, and transport, ensure a reliable and reproducible process, specifically configured to meet each customer’s unique process and product requirements.
As one of the most innovative companies in the field of packaging technology, we constantly develop new machines and modules to provide our customers with new, innovative solutions for their processes in DIE bonding, sintering or photonic bonding. In our news section, at international trade shows and conferences as well as in our social media channels we continuously inform which new developments are available to our customers.
