Pre-Sintering Processes with sinter pates on DIE transfer film (DTF)

For the implementation of a reliable sintering process, the application of the metallic bonding medium is necessary. Silver or copper sintering pastes can be applied by means of a dispenser, or the DIE transfer film process can be used. For both processes, Tresky has developed reliable solutions that ensure a reproducible process. These solutions can be used depending on the task, number of pieces or cycle time.