Learn more about the possibilities of Tresky's 
pre-sintering technology

In the videos presented here, you will be introduced to all the details of the pre-sintering process that can be implemented in Tresky’s Sinter DIE bonder. It does not matter whether you want to apply copper or thixotropic silver sinter paste. The DIE transfer film process (DTF) can also be used for the application of metallic bonding media. In the videos, you will be introduced to the different process steps that are possible around the material application.
Use of a two track conveyor system​
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Use of a two-track conveyor system

Unprocessed substrates and SiC MOSFETs can be transported simultaneously into the sintering bonder, by using a two conveyor systems. In this way, the feeding of additional SiC MOSFETs as well as the removal of finished packages can take place automatically and with optimized cycle times.

Dispensing of sintering paste
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Dispensing the sintering paste using a SQ-Nozzle.

The SQ-Nozzle developed by Tresky allows a sequential and very precise large-area application of deposits of silver or copper sintering paste. The paste is applied to each substrate in one process step, whereby defined layer heights and thicknesses can be applied, which are controlled by measuring the layer thickness.

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IE Transfer Film (DTF) for DIE attachment

During the DTF process, a thin film called a transfer film is first picked up with the DIE. The film used by Tresky has high thermal and electrical conductivity and is therefore ideal for the sintering process. The DTF process avoids the application of pastes, drying and the possible application of tacking agent.

Layer thickness measurement of sintering paste
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Layer thickness measurement of sintering paste by laser

By means of a triangulation laser, the layer thickness of the applied sintering paste is measured without contact. In the process, a distance measurement is carried out by calculating the angle. This guarantees that the dispensing applies the predefined amount of paste and thus reproducible sintering results are achieved.

Pickup and placement
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Pickup and placement of SiC MOSFETs

After the layer thickness measurement, the SiC MOSFETs are picked from the tray and placed in the applied sintering paste. A previously applied tacking agent fixes the SiC MOSFET in the sintering paste and prevents it from moving during transport to the sintering press.
Application of a tacking agent
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Applying of a tacking agent to fix SiC MOSFETs

To prevent the SiC MOSFETs from slipping from the sinter bonder during transport to the sinter press, an alcohol-based tacking agent is applied. This evaporates without leaving any residue during the sintering process.