Metallic sinter paste
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Pre-Sintering Processes on Sinter Bonders from Tresky
Prototype and batch size 1 production
In the prototyping phase, in the production of small series or batch size 1, many companies hesitate to invest in their own production line. We will gladly take over this service for you and, with a great deal of technical know-how and our many years of experience, manufacture the prototypes and small batches for you from the first piece on our systems.
Sintering paste application
In order to optimize the entire process of sintering with regard to costs and cycle times, we have developed and implemented our own process technologies. By using a dispenser SQ-Nozzle, large-area deposits of silver or copper sintering paste can be applied sequentially and very precisely. The sintering paste can thus be dispensed onto the substrate in a defined layer height and width in one process step. For process control, the layer thickness of the applied paste depot can be measured directly by laser.
Dispensing of tacking agent
The hot pick and place process is a common method of placing semiconductors for sintering. However, oxides can appear on the bare copper surface of the chip when the substrate is heated. This oxidation can be avoided by conducting the placement at room temperature. In this case, it is necessary to fix the component on the sintering paste to ensure accurate positioning on the transport route to the next process. Therefore, the chips are usually provided with an alcohol-based tacking agent.
Pick & place of components
An important process is the picking and placing of semiconductors. When using sintered matrices, hot tacking is used. This avoids any movement during transport into the sintering press. This process, also called hot pick and place, differs from the standard sintering process with pre-dried and thus no longer sticky sintering paste.
Inline or batch mode production
All DIE bonders from our machine portfolio can be used as sintering bonders. It is possible to work in both inline and batch mode. In inline mode, the DIEs and substrates are automatically transported into the machine and produced in an uninterrupted process. In batch mode, the machine is loaded manually by an operator with DIEs and substrates, e.g. in trays as waffle packs. All the production steps required for the pre-sintering process (tacking) then take place within the machine.